Fraunhofer Institute for Reliability and Micro-integration specializes in applied and industrial contract research on packaging technology and the integration of multifunctional photonics and electronics into systems. The institute covers all the competencies needed for advanced photonic packaging, such as, process development and qualification, and reliability and failure analysis with specific links to 3D wafer level packaging, silicon and glass interposer and 3D heterogeneous integration. Optical interconnection technologies, such as, photonic design, fiber optics, PIC integration, electrical-optical printed circuit boards and laser module assembly, system test are fields of excellence. The institute has a staff of more than 300 and earns 90% of the turnover through contract research. www.izm.fraunhofer.de
